EDN

Toshiba cuts capacitor from DRAM cell design

TOKYO — Toshiba Corp. has developed a one-transistor, no-capacitor cell structure that it claims solves the difficulties encountered in producing DRAMs in sub-0.1-micron process technology. The ...
EDN

MOSFET design simplifies DRAM

Pierre C. Fazan, Innovative Silicon Solutions, Le Landeron, Switzerland, Serguei Okhonin, Mikhail Nagoga, Jean-Michel Sallese, Swiss Federal Institute of Technology, Innovative Silicon Solutions, Le ...
Hosted on MSN

3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module

NEO Semiconductor is once again announcing a new technology that hopes to revolutionize the state of DRAM memory. Today, the company unveiled two new 3D X-DRAM cell designs, 1T1C and 3T0C. The ...
아시아경제

SK Hynix Yunik Son: "Relentless Innovation Thanks to One Team Spirit"

Yunik Son, team leader of the DPERI (DRAM Peripheral; the peripheral circuits required for DRAM cell operation control and data read/write) organization at the SK Hynix Future Technology Research ...
TweakTown

NEO Semiconductor's new 3D X-DRAM technology is groundbreaking 3D NAND-like DRAM

NEO Semiconductor has announced that it has developed the "world's first 3D NAND-like DRAM cell array," which aims to increase DRAM chip density using established 3D stacking technology. Designed to ...
Semiconductor Engineering

Identifying DRAM Failures Caused By Leakage Current And Parasitic Capacitance

Leakage current has been a leading cause of device failure in DRAM design, starting with the 20nm technology node. Problems with leakage current in DRAM design can lead to reliability issues, even ...
Electronic Design

Overcome Traditional Memory-Speed Barriers With Embedded DRAM

Engineers can now turbocharge their designs without having to sacrifice DRAM's high bit density to run at near-SRAM speeds. For applications where performance is of primary importance, designers have ...
Hackaday

Versatile DRAM Board Adds Memory To Any Heathkit H8 Variant

Ask anyone to name a first-generation home computer from the 1970s, and they’ll probably mention the likes of the Altair 8800 and IMSAI 8080. But those iconic machines weren’t the only options ...
Nasdaq

Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling

SANTA CLARA, Calif., May 05, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and ...
Digi Times

iCometrue is actively promoting logic drive and field programmable multi-chip package

iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package ...
Yahoo Finance

AMAT's Logic & DRAM Offerings Gain Traction: How Long Will it Sustain?

Applied Materials’ AMAT Logic and DRAM businesses are gaining traction on the back of rising demand for AI infrastructure. On fiscal third-quarter 2025 earnings call, AMAT highlighted its leadership ...
Hackaday

dram controller

Ask anyone to name a first-generation home computer from the 1970s, and they’ll probably mention the likes of the Altair 8800 and IMSAI 8080. But those iconic machines weren’t the only options ...