As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The complexity of DRC rules increases with shrinking geometries. It is not that the laws of physics change with shrinking IC feature size; they are just more strictly enforced. At one time, there was ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

In the burgeoning Low-Earth Orbit (LEO) satellite market, Taiwanese manufacturers have traditionally found their niche in subcontracting component assembly and antenna integration, rather than carving ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...