Complete Probe Solutions developed Single Die Alignment for automatically probing die that are not precisely positioned or misaligned relative to each other. The Single Die Alignment feature makes it ...

Electroglas Inc. today rolled out probe card alignment technology designed to improve probing accuracy for small device geometries and tight-pitch applications. The Fiducial Alignment technology ...

With a focus on parallel optimization and nanoscale accuracy, precision positioning specialist PI is streamlining the optical alignment, test and packaging of quantum photonic devices Parallel lines: ...

Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

Harmony eXP, a full-wafer-contact probe card from FormFactor, can test more than 1000 DRAM devices per touchdown and is capable (for some device designs) of supporting one-touchdown testing of a full ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

The continuing advances in semiconductor functionality, density, and chip-level integration are generating new challenges in accessing devices for test and controlling the physical and electrical ...

The huge number of ICs used in today’s electronic products is difficult to comprehend, and each one has to be tested. Traditionally, testing starts at the wafer level to determine gross defects. By ...