Packaging, assembly and test house ChipPAC Inc. said today it is in high volume production of what it claims is the first four-and five-die stacked chip scale package (CSP) in a thin 1.4mm profile.
ChipPAC, a US-based packaging and testing house, on November 11 announced delivery of its six stacked-die CSP (chip-scale package) solution in 1.6mm profile, according to a company press release. Save ...
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