Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...

One of the most significant challenges in the electronics industry is the formation of voids in solder joints. Voiding typically occurs when flux or solvent in the paste becomes trapped in the joint, ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

CARLSBAD, Calif., May 2, 2019 /PRNewswire-PRWeb/ -- Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced that SST ...

SHENMAO America, Inc. is proud to announce the launch of its advanced solder paste, PF606-P275. This innovative lead-free, no-clean, zero- halogen solder paste is specifically designed for fine-pitch ...

LINCOLN, R.I.--(BUSINESS WIRE)--Aug. 8, 2006--The Solder Paste Group of EFD, Inc. and Leister Technologies LLC have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, ...

Assembling with a stencil is just that much more convenient – it’s a huge timesaver, and your components no longer need to be individually touched with a soldering iron for as many times as they have ...

There are almost as many ways to reflow a surface-mount circuit board as there are hackers. Today, we add another method to the list. [Dasaki] converted a halogen floodlight into an SMT oven, and did ...