"Single Lane - SPC Statistical Process Control - Germany IDS 5.3M Pixel -Machine Customisation is available 3D SPI Specification: Model EKT-8060A Board Handling PCB Size Min: 55*55mm – Max: 400*350mm ...
Test Research of Taiwan has revealed its latest automatic solder paste inspection machine using 3D vision, that can also inspect bumps, flux, mini LEDs and bare boards. Called TR7007Q SII it has a ...
Key Companies Covered in the 3D Solder Paste Inspection (SPI) System Market Research are MirTec Ltd, Pemtron, CyberOptics Corporation, Koh Young, PARMI Corp, Test Research, Inc (TRI), Vi TECHNOLOGY, ...
Many companies employ some kind of inspection to verify process steps within their surface-mount technology (SMT) lines. Because solder-paste volume is an important predictor of solder-joint quality ...
TOKYO--(BUSINESS WIRE)--Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, will demonstrate new automated inspection products, software, ...
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets. 3D Multiple Reflection Suppression (MRS) sensor ...
Built on Saki's proven high-rigidity gantry structure, the 3Si/3Di-EX Series introduces a modular hardware design that allows seamless optical unit upgrades, ensuring long-term adaptability to ...
BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...
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