Unlock the future of semiconductor innovation with chiplets — enabling scalable, cost-effective designs and paving the way ...

Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, ...

BETHESDA, MD, UNITED STATES, January 13, 2026 /EINPresswire.com/ -- Fasoo, the leader in data-centric security, ...

Opportunities in the chiplets market are driven by rising demand for high-performance computing, adoption of modular ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Southborough technology firm Virtusa is expanding its presence further into Asia with the acquisition of SmartSoC Solutions, ...

Electronics are everywhere. As daily life becomes more digital and more devices become software defined and interconnected, the prevalence of electronics will inevitably rise. Semiconductors are what ...

India Semiconductor Mission 2.0 shifts focus from chip assembly to full-scale manufacturing, equipment and design, aiming to boost jobs and reduce import dependence.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

It will accelerate semiconductor design and manufacturing, boost electronics value addition, and expand cooperation across AI, data centres, and advanced manufacturing, says Ashok Chandak, President, ...

The India-US trade deal enhances semiconductor collaboration, boosting India’s role in chip design and advanced technology sectors.

India aims to manufacture advanced 3-nanometre chips by 2032. Union Minister Ashwini Vaishnaw outlines a six-category ...