Taiwan has launched CoCoB, a substrate-less chip packaging platform targeting academic institutions and startups locked out ...
SK Hynix Inc. is preparing a major capacity push as the global race to build AI-ready data centres strains the memory supply chain. The South Korean chipmaker plans to invest 19 trillion won ($12.9 ...
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SK Hynix unveils $12.9B AI chip packaging expansion
SK Hynix, one of the leading South Korean suppliers of high-bandwidth memory, plans to invest approximately 19 trillion won, ...
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Amkor Technology (AMKR) Is Up 33.5% After Highlighted Role In Advanced AI Chip Packaging Services
In recent days, Amkor Technology has drawn attention as analysts highlighted its role in supplying advanced semiconductor packaging and test services for fast-growing AI-focused chips, including CPUs, ...
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