FormFactor (www.formfactor.com) has introduced a test platform for automotive devices that can reduce wire bond or system-on-chip device pad pitch as low as 60µm, increase the number of die tested in ...
A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...
Testing multiple devices at the same time is not providing the equivalent reduction in overall test time due to a combination of test execution issues, the complexity of the devices being tested, and ...
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