MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

Companies building the largest AI accelerators face a growing cost problem that has nothing to do with transistors. The ...

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

AI has become a key driver for the semiconductor industry as it is applied to ever more aspects of daily life. Many startups and established vendors are designing AI chips to accelerate algorithms and ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but here’s ...

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces. Apple is anticipated to bring out ...

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the demand for higher performance in increasingly compact form factors [1]. Over ...