Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

GlobalFoundries, a semiconductor manufacturing company with locations around the world, invested $575 million to build the new center, as well as an additional $186 million for research and ...

“The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the ...

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...

Amkor Technology (NASDAQ:AMKR) supports global semiconductor packaging, appearing in discussions around best nasdaq stocks.

The ongoing rise of generative AI is driving the entire semiconductor industry toward unprecedented growth. The global semiconductor market is expected to exceed $1 trillion by 2030, with a strong 8.7 ...

The two funds target startups in areas such AI and renewable energy across Asia, the U.S. and the EMEA. Kyocera, one of the world’s largest chip component makers, has unveiled two funds totalling $100 ...

MALTA, N.Y. (NEWS10) — GlobalFoundries will create a new center for chip packaging and testing in Malta, the company announced on Friday. The facility will be called the New York Advanced Packaging ...