Aries Electronics has introduced a high-frequency center probe test socket in a standard molded format that enables the socket to accommodate any 6.5-mm or smaller CSP, MicroBGA, DSP, LGA, SRAM, DRAM, ...

High-frequency center-probe and CSP/MicroBGA test and burn-in sockets are offered in sizes to 6.5-mm2 with pitches down to 0.3 mm to meet the growing need for testing smaller components. The sockets ...

The company's micro BGA and CSP test and burn-in sockets can accept devices measuring up to 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both components employ ...

Test sockets might seem relatively simple compared with the test equipment with which they are used, but in fact they are quite complex and specialized, said Paul F. Ruo, VP of sales and marketing at ...