In recent days, Amkor Technology has drawn attention as analysts highlighted its role in supplying advanced semiconductor packaging and test services for fast-growing AI-focused chips, including CPUs, ...

ASE Technology (NYSE:ASX) delivers semiconductor assembly, testing, and IC packaging services, supporting engineering, supply ...

The artificial intelligence (AI) revolution has expanded rapidly since 2023, powering applications from chatbots to ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to ...

Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...